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Additional resources for Advances in Joining of Ceramics, Volume 138
J. Appl. Phys. Part 1 - Regul. Pap. Short Notes Rev. Pap. 40[5B]: 3789 - 3791,2001. 59. J. P. Huang, Y. R. Fu, "Evaluation of Si3N4 Joints: Bond Strength and Microstructure," J. Mat. Sci, 34  1783-1790,1999. 26 Advances in Joining of Ceramics 60. S. Gam, K. S. Han, S. S. Park and H. C. Park, "Joining of TiB2-A1203 using compositionally graded interlayers", Mater. Manuf. Process, 14: 537 546, 1999. 61. A. Marks, D. R. Chapman, D. T. Danielson and A. M. , 48: 4425 - 4438, 2000. 62. Gopal, M. Sixta, L.
Case and K. Y. Lee, "Enhancing the Microwave Processing of Ceramics by Avoiding Hot Spots and Local Melting in Refractory Specimen Enclosures ", Journal of Advanced Materials, 34: 49 - 59,2002. 42. Y. Lee and E. D. Case, "A Comparison of theoretical and experimental profiles for thermally-induced grain-boundary grooving", European Physical Journal, Applied Physics, 8: 197- 214,1999. 43. D. Case, K. Y. Lee, and J. G. Lee, "Joining of Polycrystalline Ceramics and Ceramic Composites Using Microwave Heating," pp.
57 Advances in Joining of Ceramics 38 CONCLUSIONS In graded joint design it is clear that one must account for both applied and residual stresses, and that very different failure modes obtain for joints with different toughness. Furthermore, the stress fields present in the absence of cracks, as one might obtain by finite element analysis, may not reveal the type of failure expected when flaws are present in the interlayers. The current work has shown that the type of failure within a graded joint may depend strongly on the architectural parameters and the toughness of the interlayer containing the critical flaw.